New materials could boost the energy efficiency of microelectronics
By stacking multiple active components based on new materials on the back end of a computer chip, this new approach reduces the amount of energy wasted during computation.
Computer chips
Agreement between MIT Microsystems Technology Laboratories and GlobalFoundries aims to deliver power efficiencies for data centers and ultra-low power consumption for intelligent devices at the edge.
Read MoreMIT engineers grow “high-rise” 3D chips
An electronic stacking technique could exponentially increase the number of transistors on chips, enabling more efficient AI hardware.
Read MorePhotonic processor could enable ultrafast AI computations with extreme energy efficiency
This new device uses light to perform the key operations of a deep neural network on a chip, opening the door to high-speed processors that can learn in real-time.
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